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Etching Machine

Etching Machine

Development, etching and peeling of the inner plate
1) Stable production of 0.1-2.0mm (without copper) substrates

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Development, etching and peeling of the inner plate
1) Stable production of 0.1-2.0mm (without copper) substrates

Development, etching and peeling of the inner plate
1) Stable production of 0.1-2.0mm (without copper) substrates
2) Minimum line width/line spacing: 3/3mil